AMD Embedded Computing Summit & AMD Webinar Highlights
The VCS³ Showcased
AMD Embedded Computing Summit
As an AMD Adaptive Computing Partner, Sundance attended the AMD Embedded Computing Summit in London as part of the Embedded Computing Summit Global Technical Tour.
“The Embedded Computing Summit (ECS) Global Technical Tour is the premier in-person technical event series from AMD, bringing together engineers, architects, and technology leaders who are building the next generation of embedded systems.
Delivered across North America, EMEA, Greater China, and APJ, ECS goes beyond product overviews, diving deep into design tradeoffs, performance optimization, system architecture, and practical techniques you can apply immediately to active projects. Whether you’re closing timing, optimizing DSP pipelines, migrating platforms, or deploying AI at the edge, ECS provides the technical depth and expert access needed to move your designs forward.
Each one-day event features multiple technical tracks, allowing you to tailor your experience based on your design focus. Move freely between sessions, engage directly with AMD engineers through live Q&A, and see live demos of our latest technologies from AMD and partners, all as part of a globally consistent program delivered locally.” – AMD
CEO, Flemming Christensen, represented Sundance at the event, supporting our partner Trenz Electronic. The event was a success, with the VCS³ 3D Kit showcased.
AMD Webinar
AMD hosted a webinar titled ‘Designing with Super-fine-pitch (0.5mm) AMD Embedded Devices’. Sundance’s CEO, Flemming Christensen, was a speaker for the webinar showcasing the VCS³. Other speakers for the event were Semitown’s Arnie Grever, Adiuvo’s Adam Taylor, and AMD’s Bryan Fletcher.
This was the first of three webinars exploring 0.5mm pitch packaging. The series will address multiple angles to develop either high-performance or low-cost PCBs with 0.5mm packages. The focus of the first webinar was to investigate high-performance 0.5mm pitch HDI methodology. Speakers presented multiple advantages of super-fine pitch packages as well as documentation, an example PCB, and a technical module to aid designers. Attendees saw a high-performance AMD Zynq™ UltraScale+™ MPSoC design on a super-small Sundance Multiprocessor SOM. Semitown explained the Sundance SOM manufacturing process and demystified the technique and cost of underfilling. There was also a preview a very low-cost Adiuvo evaluation board built using low-cost FR4 and through-hole vias.
To watch back the AMD Webinar click below to register and watch:
VCS³ Core – Probably the smallest single-board computer based on an AMD Zynq MPSoC
Ultra-compact, low-power, Vision, Control and Sensors Solution for Precision Robotics
The VCS³ is a small Single-Board-Computer with an AMD ZYNQ™ device with integrated ARM CPUs and FPGA fabric. Measuring just 30mm x 50mm, this tiny workhorse can be placed almost anywhere, opening up the benefits of FPGAs to many more applications.
The VCS³ utilises an AMD UltraScale+ MPSoC coupled with high-speed LP-DDR4 memory to produce a highly compact evaluation platform. Together with four digital camera interfaces, a 9-axis IMU, and a CAN-Bus interface, this platform is ideally suited for autonomous machines, cameras or automation.
Device booting can be from SPI ROMs or eMMC flash, with no bulky, fiddly or unreliable SD cards.
Numerous onboard power rails are generated from a single external 5V supply, or via a USB Type-C interface.
Several LEDs indicate board functionality, and numerous test points allow access to the various interfaces.