Designing with Super-fine-pitch (0.5mm) AMD Embedded Devices
18th June 2026, ONLINE LIVESTREAM
The latest AMD webinar is set to take place on Thursday June 18th, this week from 3:00PM-4:00PM. The topic for the event is ‘Designing with Super-fine-pitch (0.5mm) AMD Embedded Devices’ and will explore super-fine-pitch packaging, the AMD devices that offer it, and how to take advantage of this technology. Whilst also sharing best practices for successful PCB and system design with super-fine-pitch packages.
“Super-fine-pitch packaging from AMD provides the smallest possible dimensions and the most affordable devices in the AMD portfolio. Super-fine-pitch is defined as packages with 0.5 mm ball pitch. AMD offers two super-fine-pitch types: Chipscale (CSP) and Integrated Fan-Out (InFO). Super-fine-pitch devices give designers a significant advantage in space-constrained applications like cameras, drones, medical devices, and robotics.” – AMD
Webinar Agenda:
- Exploring the advantages of super-fine-pitch packaging
- Explaining the super-fine-pitch PCB design strategies for high performance
- Sharing the high-performance super-fine-pitch example
Webinar Speakers:
- Bryan Fletcher (AMD, Senior Marketing Manager)
- Arnie Grever (Semitown Technology, CMO)
- Adam Taylor (Adiuvo Engineering)
- Flemming Christensen (Sundance, CEO)
Representing Sundance, CEO Flemming Christensen will be going into detail how the VCS³ SBC is one of the best examples of high-performance super-fine-pitch.
VCS³ Core – Probably the smallest single-board computer based on an AMD Zynq MPSoC
Ultra-compact, low-power, Vision, Control and Sensors Solution for Precision Robotics
The VCS³ is a small Single-Board-Computer with an AMD ZYNQ™ device with integrated ARM CPUs and FPGA fabric. Measuring just 30mm x 50mm, this tiny workhorse can be placed almost anywhere, opening up the benefits of FPGAs to many more applications.
The VCS³ utilises an AMD UltraScale+ MPSoC coupled with high-speed LP-DDR4 memory to produce a highly compact evaluation platform. Together with four digital camera interfaces, a 9-axis IMU, and a CAN-Bus interface, this platform is ideally suited for autonomous machines, cameras or automation.
Device booting can be from SPI ROMs or eMMC flash, with no bulky, fiddly or unreliable SD cards.
Numerous onboard power rails are generated from a single external 5V supply, or via a USB Type-C interface.
Several LEDs indicate board functionality, and numerous test points allow access to the various interfaces.
AMD Webinar
Where: ONLINE
When: 18th JUNE 2026 – 3:00 PM-4:00PM