Trenz Electronic at the FPGA Conference Europe

Munich, Germany. 4 – 6 July 2023

It’s a month to go until Trenz Electronic will be exhibiting at the FPGA Conference Europe. If you’re attending, be sure to visit them!

They will present their TE0950 AMD Versal™ AI Edge Evalboard at the conference, along with their wide variety of other products. Sundance is the UK distributor for Trenz Electronic products, please browse the catalogue below and get in touch with us with any requirements.

The FPGA Conference Europe, organized by ELEKTRONIKPRAXIS and the FPGA training centre PLC2, is Europe’s leading specialist conference for programmable logic devices. The conference focuses on user-oriented, practically applicable solutions that developers can quickly integrate into their everyday work. Take advantage of the combined knowledge of top-class FPGA experts!

In increasingly AI-driven cloud data centres, in telecommunications and many other high-performance applications, Field Programmable Gate Arrays (FPGA) have proven themselves as flexible and powerful accelerator solutions for various tasks.

At this year’s event, one focus is on the energy efficiency of flexible logic devices. This applies particularly to small, low-power components that rely on special production techniques or deliberately have only a limited number of programmable cells.

FPGAs belong to the hidden champions of microelectronics and are at the forefront of embedded development. From tiny and energy-efficient sensor fusion solutions for the automotive industry to intelligent platforms for condition monitoring in networked factories to powerful deep learning accelerators in the largest data centres, these flexible logic devices play an essential role in many applications. They will be discussed during the FPGA Conference Europe in Munich.

Trenz Electronic 2023 Catalogue

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Download the full Trenz Electronic catalogue here.

TE0950 AMD Versal™ AI Edge Evalboard with VE2302 device


The Trenz Electronic TE0950-01-EGBE11A is a powerful adaptive SoC evaluation board, equipped with an AMD Versal™ AI Edge VE2302 device (engineering sample). Furthermore, the board is equipped with 4 GByte DDR4 SDRAM and 128 MByte SPI Flash for configuration and data storage as well as powerful switching power supplies for all required voltages. A large number of inputs and outputs are provided by robust, flexible and cost-effective high-speed connectors.

All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • SoC
    • AMD Versal™ AI Edge XCVE2302-1LSESFVA784 device (engineering sample)
      • A784 package (pin compatible VE2002, VE2102, VE2202, VE2302, VM1102)
  • RAM/Storage
    • 4 GByte DDR4 SDRAM
    • 128 MByte SPI Flash (primary boot option)
    • MicroSD card (primary boot option)
    • 32 GByte e.MMC (secondary boot option)
    • EEPROM with MAC-address
  • On Board
    • AMD Artix™ 7 FPGA as configurable Levelshifter/MUX for FMC and other 3.3 V IOs
      • 32 MByte SPI Flash
      • 1 dip switch
      • 2 LEDs
    • USB 2.0 Host/Device/OTG (type Micro A/B connector)
    • USB JTAG + UART Micro-USB B
    • Gigabit Ethernet RJ45
    • Output
      • 2 LEDs (1 x MIO, 1 x PL)
    • Input
      • 1 push button
      • 3 dip switches (2 x MIO, 1 x PL)
      • Reset button
  • Interface
    • zQSFP with 4 GTYP Transceiver
    • 2 x CRUVI HS (each optimized for 4 Lane MIPI, one with reduced pinout)
    • 2 x CRUVI LS
    • CSI-2 connector (camera, 2 lane MIPI)
    • FMC
      • 4 GTYP Transceiver
      • 34 LA diff pairs to Levelshifter/MUX
  • Power
    • 12 V plug
  • Dimension
    • 150 mm x 120 mm

Contact us for more information