HARDWARE PIONEERS MAX 2026
Excel London, 10 – 11 June 2026
Less than two weeks to go until you can meet Sundance at Hardware Pioneers Max!
Recognised as one of the UK’s leading events for electronics, embedded systems, and connected hardware development, Hardware Pioneers Max brings together engineers, innovators, start-ups, and global technology companies to showcase the latest advances shaping the industry. The event offers an excellent opportunity to discover emerging technologies, connect with industry experts, and explore solutions driving next-generation product development.
Visit Sundance to see live demonstrations of the SMT135-C and the VCS³ 3D Kit, alongside our partner Red Pitaya’s Lego Quantum Computer demonstration.
When: 10 – 11 JUNE 2026
Where: EXCEL LONDON
ROYAL VICTORIA DOCK, 1 WESTERN GATEWAY, LONDON, E16 1XL
FIND US @ STAND Q20
GET A FREE TICKET TO THE EVENT
Following this link (HERE), use the code below to get a FREE ticket.
DNPQL
Codes are limited, so act fast to redeem your complimentary TICKET.
When the codes are gone, they’re gone!
Some of the products we will be showcasing:
SMT135-C
An Efinix Titanium Ti135 Evaluation Board for edge computing, real-time control, and vision-centric workloads.
The SMT135-C Evaluation Board is based on a SoM6 Ti135, a compact, low-power System-on-Module (SoM) built around the Efinix Titanium Ti135 FPGA, in the high-density N676 package.
Designed for advanced embedded applications requiring performance, flexibility, and energy efficiency, the SoM6 Ti135 integrates a rich set of modern features in a form factor that emphasises modularity and interoperability.
The SMT135-C expands on the SoM6’s functionality by providing a range of additional I/O options. Including a Gigabit Ethernet Interface, SFP Interface, Samtec Firefly Mid-Board Optical Transceiver, SD Card Interface and the option for 8-Lane MIPI TX and RX Operation.
Key SoM Processing and Fabric Features – at the core of the SoM is the Efinix Ti135 FPGA, fabricated on a TSMC 16nm process and featuring the Quantum™ compute fabric.
This fabric includes:
- Up to 129,600 logic elements using eXchangeable Logic and Routing (XLR) cells
- 960 blocks of 10-kbit SRAM (totalling ~9.83 Mbits)
- 480 DSP blocks supporting integer and BFLOAT16 computations
- A quad-core hardened RISC-V processor with full support for RV32IMACFD extensions
These features combine to make the SMT135-C a strong candidate for edge computing, real-time control, and vision-centric workloads.
VCS³ 3D Kit
A compact, ready-to-assemble embedded vision system designed for rapid prototyping, education, and advanced development. Built around the powerful VCS³ Core (AMD Zynq UltraScale+MPSoC), the kit combines ARM processing with FPGA acceleration for real-time vision and control tasks.
The VCS³ 3D Kit demonstrates the VCS³ Core’s compact size and performance in video processing applications. Measuring just 30mm x 50mm, this tiny workhorse can be placed almost anywhere, opening up the benefits of FPGAs to many more applications. The VCS³ 3D Kit also includes dual camera modules, a 10.1″ high-resolution display, a VCS³ RP2040 co-processor board, and a complete set of 3D-printed mounts, enclosures, and cables, enabling users to quickly assemble a fully functional stereoscopic vision system.
Ideal for machine vision, robotics, sensor fusion, and FPGA-accelerated computing, the VCS³ 3D Kit offers a professional-grade platform in a compact, desktop-friendly form factor — perfect for labs, developers, and innovators pushing beyond traditional single-board computers.
Components included:
- 1x Sundance VCS³ Core
- 1x Sundance VCS³ RP2040 card
- 1x screen (10.1″, 1920×1200, 34 pin)
- 2x Raspberry Pi Camera Module 2 (15 pin)
- 1x fan (30mm x 30mm, 5V)
- 1x mini JST 2 pin male connector
- 3D printed holder for the system
- Full cable kit
- Full fixing kit
VCS³ Core
Probably the smallest single-board computer based on an AMD Zynq MPSoC
Ultra-compact, low-power, Vision, Control and Sensors Solution for Precision Robotics
The VCS³ is a small Single-Board-Computer with an AMD ZYNQ™ device with integrated ARM CPUs and FPGA fabric. Measuring just 30mm x 50mm, this tiny workhorse can be placed almost anywhere, opening up the benefits of FPGAs to many more applications.
The VCS³ utilises an AMD UltraScale+ MPSoC coupled with high-speed LP-DDR4 memory to produce a highly compact evaluation platform. Together with four digital camera interfaces, a 9-axis IMU, and a CAN-Bus interface, this platform is ideally suited for autonomous machines, cameras or automation.
Device booting can be from SPI ROMs or eMMC flash, with no bulky, fiddly or unreliable SD cards.
Numerous onboard power rails are generated from a single external 5V supply, or via a USB Type-C interface.
Several LEDs indicate board functionality, and numerous test points allow access to the various interfaces.
| Dimensions | 50mm x 30mm |
| Weight (no heatsink) | 10g |
| Weight (with heatsink) | 30g |
| Supply Voltage | +5V ±5% |
| Supply Current | 3A max. |
| MTBF | On request |