NOT FOR NEW DESIGNS
PCI-104 Carrier (SMT130) and a ADC Module; Dual Channel 1GHz, 8-bit ADC; Sundance High-speed Bus; Xilinx Virtex II VP30-6 FPGA; (RSL) Rocket Serial Link; DDR SDRAM (SMT391)
The SMT291 is made up of the SMT130 (a PCI-104 single site TIM specification carrier) and an SMT391 (ADC Module; Dual Channel 1GHz, 8-bit ADC; Sundance High-speed Bus; Xilinx Virtex II VP30-6 FPGA; (RSL) Rocket Serial Link; DDR SDRAM)
The SMT130 is a single site module carrier developed to provide access to a TIM module over the PCI-104 PCI bus.
Data transfers of 50-100Mbytes per second can be achieved to and from the Global Bus when accessing the SRAM and PCI Bridge, allowing fast data transfers.
The card has an ‘on-board’ JTAG controller which is software compatible with the XDS-510. This allows Code Composer studio and 3L applications to be used to debug/upload software to a DSP TIM.
The SMT391 is a single width TIM module. It is capable of sampling two analogue inputs at 1 GSPS with a resolution of 8 bits. An Atmel duel channel ADC (AT84AD001) performs the analogue to digital conversion.
Digital data is output to a Xilinx Virtex-II Pro FPGA ((XC2VP30-6 in FF896 package), which controls data transfers via ComPorts or the Sundance High-speed Bus (SHB). A copy of the data is also streamed over the RocketIO Serial Links on the module (RSL). These interfaces are compatible with a wide range of Sundance processor and I/O modules.
An on-board microprocessor loads the default configuration via the ComPorts into the FPGA at start up. The FPGA can be dynamically re-configured at any time. Configuration, sampling and transfer modes are set by configuration data received over either the ComPorts or the Rocket Serial Links.
The SMT391 is a ‘Daughter-Module’ that combines with the SMT338-VP Module and the interface between the SMT338-VP and the SMT391 is done using the Sundance LVDS Bus (SLB) and all the analogue circuits are on the top PCB and the digital circuits are on the bottom to reduce the cross-talk, provide better separation and heat-dissipation.