MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E / ZU4EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm

The Trenz Electronic TE0813-01 is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ with ZU2CG / ZU4EG, 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Download the full Trenz Electronic catalogue here.

Key Features

• Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E or XCZU4EG-1SFVC784E
• ZU2CG / ZU4EG, 784 pin package
• Size: 5.2 x 7.6 cm
• Plug-on module with 4 x 240 pin B2B connectors
• Rugged for shock and high vibration
• 3 mm mounting holes for skyline heat spreader
• 2 GByte (64-bit width) DDR4 SDRAM
• 128 MByte QSPI Boot Flash dual parallel
• 2 Kbit serial EEPROM with EUI-48 Node Identity
• Graphic Processing Unit (GPU)
• Si5338A – 4 output PLL
• User I/O
  • 65 x multi-use I/O’s (MIO)
  • 48 x high-density (HD) I/O’s (all)
  • 156 x high-performance (HP) I/O’s (3 banks)
  • Serial transceiver: 4 x GTR 4
  • Programmable 4-channel PLL clock generator
• All power supplies on board
• Single 3.3V power source or 5V and 3.3V standby power sources required
• Evenly spread supply pins for good signal integrity