by Ben Lovell | Jul 24, 2020 | Uncategorized
Internship opportunity as part of the 2020 HiPEAC Internship program Submission deadline: Aug. 24, 2020Career levels: Assistant Researcher, Engineer, PhD student, Research AssociateKeywords: Disruptive technologies, Embedded / Cyber-Physical Systems, Energy efficiency...
by Ben Lovell | Jul 3, 2020 | Uncategorized
The Future of PC104 The following is an excerpt from this article by George Hillard for Embedded Computing Design: Even with the Type 2 pin-out, many CPUs couldn’t utilize the full three-bank, high-speed connector. So the PC104 consortium approved the Type 3 (OneBank)...
by Ben Lovell | Jun 12, 2020 | Uncategorized
An excellent article on Sundance by the Knowledge Transfer Network. Original article can be seen here. Sundance Multiprocessor Technology Ltd was founded in 1989 with a focus on design, manufacturing and testing of electronics embedded modules, based on a leading-edge...
by Ben Lovell | May 18, 2020 | Uncategorized
Sundance launches the VF370 Intel-based 3U OpenVPX SBC module for SWaP applicationsHighly flexible architecture combining Intel Atom E3900 Series embedded processors, Intel Cyclone FPGA technology and an FMC mezzanine siteIdeally suited to extreme environments,...
by Ben Lovell | Mar 27, 2020 | Uncategorized
An excellent article by Andrew Swirski, the founder and managing director of Beetlebox, a Computer Vision Acceleration specialist. His original article can be found here. Over recent years, cloud processing has become cheaper and more available to the point where...
by Ben Lovell | Mar 20, 2020 | Uncategorized
This is a small footprint System On Module (SOM) with 40x50mm dimensions. It has a low power, highly secure FPGA from the PolarFire family from Microsemi. It comes with 4GB of DDR4 memory, Ethernet PHY, and FLASH. This SOM is ideal for being used in complex hardware...
