HiPEAC Internship opportunity

HiPEAC Internship opportunity

Internship opportunity as part of the 2020 HiPEAC Internship program Submission deadline: Aug. 24, 2020Career levels: Assistant Researcher, Engineer, PhD student, Research AssociateKeywords: Disruptive technologies, Embedded / Cyber-Physical Systems, Energy efficiency...

The Future of PC104 The following is an excerpt from this article by George Hillard for Embedded Computing Design: Even with the Type 2 pin-out, many CPUs couldn’t utilize the full three-bank, high-speed connector. So the PC104 consortium approved the Type 3 (OneBank)...
Press Release – VF370

Press Release – VF370

Sundance launches the VF370 Intel-based 3U OpenVPX SBC module for SWaP applicationsHighly flexible architecture combining Intel Atom E3900 Series embedded processors, Intel Cyclone FPGA technology and an FMC mezzanine siteIdeally suited to extreme environments,...
SoM3-MPF300T with Microsemi Polarfire FPGA

SoM3-MPF300T with Microsemi Polarfire FPGA

This is a small footprint System On Module (SOM) with 40x50mm dimensions. It has a low power, highly secure FPGA from the PolarFire family from Microsemi. It comes with 4GB of DDR4 memory, Ethernet PHY, and FLASH. This SOM is ideal for being used in complex hardware...