CalidCAM – Thermal Imaging

CalidCAM – Thermal Imaging

With the world looking to return to work and get back to something closer to normal, new solutions to help prevent further spreading of Covid-19 will need to be found. According to the World Health Organisation, the most common symptom of Covid-19 is a fever. CalidCAM...
HiPEAC Internship opportunity

HiPEAC Internship opportunity

Internship opportunity as part of the 2020 HiPEAC Internship program Submission deadline: Aug. 24, 2020Career levels: Assistant Researcher, Engineer, PhD student, Research AssociateKeywords: Disruptive technologies, Embedded / Cyber-Physical Systems, Energy efficiency...

The Future of PC104 The following is an excerpt from this article by George Hillard for Embedded Computing Design: Even with the Type 2 pin-out, many CPUs couldn’t utilize the full three-bank, high-speed connector. So the PC104 consortium approved the Type 3 (OneBank)...
Press Release – VF370

Press Release – VF370

Sundance launches the VF370 Intel-based 3U OpenVPX SBC module for SWaP applicationsHighly flexible architecture combining Intel Atom E3900 Series embedded processors, Intel Cyclone FPGA technology and an FMC mezzanine siteIdeally suited to extreme environments,...